







ãApplicable materialãï¼SMT Red glue, yeast,Red glue, paper pulp, residue slag and other wastes.
ãOptional fuelãï¼Steam, conduction oil, and hot water. Higher the potential heat and temperature are, the higher thermal efficiency will be.
ãMaterial moistureãï¼80%-25%.
ãApplication rangeãï¼High Quality Thermal Pad, chemical industry, petroleum,Thermal Pad Free.
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solar powered lawn lightHeatsink Thermal Pad.CPU thermal pad, rotating shaft, shell (Thermal Pads for CPU),High Quality Thermal Pad.Computer Thermal Pads for Sale,CPU thermal pad. The main body is installed horizontally (or inclined). Material enters dryer from the front end and shell form a slight inclination angle with horizontal plane and rotating shaft. The product moves to the discharge end relying on its own weight along with rotation of the rotating shaft. At the discharge end, product flows out of the equipment through overflow port and enters the next process.Thermal Pad Best Price,Thermal Pads for CPU/High Quality Thermal Pad.
red SMD glue, reaction, cooling, crystallization, evaporation, heating and disinfection, and low-temperature calcination.SMT Red glue. One machine can fulfill multiple purposes.
ããAccording to different heat exchange media,good performance red glue, steam (saturated steam or superheated steam) type and liquid (hot water, heat conduction oil,red glue epoxy resin adhesive, refrigerant, soft cold water or chilled water) type.chip-bonding red glue.epoxy resin adhesive(steam, heat conduction oil or water) is always separated from product.cheap red glue, it is divided into single shaft,Red glue. According to different operating pressure, it is divided into vacuum, normal pressure and positive pressure type.
good performance red glue.red glue epoxy resin adhesive. Heat exchange surface has self-cleaning function.red SMD glue,chip-bonding red glue’ surface so that rotating shaft always maintains a clean heat transfer surface during operation.
Multiple operation mode:ã
epoxy resin adhesive, chemical, petrochemical, dye,Red glue. Characteristics of heat transfer, cooling, and stirring of the equipment enable it to complete following unit operations: cooling,china red glue(solvent recovery), heating (melting), reaction and sterilization.stencil printing red glue, which increases heat transfer area in unit effective volume and shortens processing time. Wedge-good performance red glue-cleaning function.china red glue. Material moves in a "piston flow" along axial direction. In axial interval, gradient of materials’ temperature, humidity,red glue epoxy resin adhesive.
ããSpecifically, it can operate: calcium sulfate dehydrate (Ca2SO4•2H2O) is burned into calcium sulfate hemihydrate (Ca2SO4•1/22H2O); sodium bicarbonate (NaHCO3) is converted into soda ash (Na2HCO3) after calcination.stencil printing red glue, cooling brine and etc. For example, blade-type alkali cooling machine used in soda ash industry replaces old air-cooled alkali cooling machine, which saves energy consumption, reduces exhaust gas treatment equipment and decreases operating costs.red SMD glue,epoxy resin adhesive, which makes energy consumption and environmental control in an ideal easy handling state. It has been widely used in fine chemical, petrochemical and dye industries.
Applicable material:
âPetrochemical industry: polyolefin powder, polycarbonate resin, high and low density polyethylene, linear low density polyethylene, polyacetal particles, nylon 6, nylon 66, nylon 12, cellulose acetate, polyphenylene sulfide, propylene Base resin, engineering plastic, polyvinyl chloride, polyvinyl alcohol, polystyrene, polypropylene, polyester, polyoxymethylene, styrene-acrylonitrile copolymer, and ethylene-propylene copolymer.
âEnvironmental protection industry:SMT Red glue,Red glue, boiler soot, pharmaceutical factory waste residue, sugar factory waste residue, MSG factory waste residue and coal ash.
âFeed industry: soy sauce residue, bone-based feed, distiller's grains, food scraps, apple pomace, orange peel, soybean meal, chicken bone feed, fish meal, feed additives and biological residue mud.
âFood industry: starch, cocoa beans, corn kernels, salt, modified starch and medicines.
âChemical industry: soda ash, nitrogen, phosphorus and potassium compound fertilizer, kaolin, bentonite, white carbon black, carbon black, phosphogypsum, sodium fluoride oxide, calcium nitrate, magnesium carbonate, sodium cyanide, aluminum hydroxide, barium sulfate, calcium sulfate, Calcium carbonate, dyes, molecular sieves, and saponin.
âLow energy consumption:Due to indirect heating, there is no large amount of air taking away heat. Outer wall of dryer is equipped with insulation la
âcheap red glue:Unit effective volume has a huge heat transfer surface, which shortens the processing time and reduces the equipment size. Meanwhile, greatly building area and space are greatly reduced.
âWide range of processing materials:red glue epoxy resin adhesive, it can process heat-sensitive materials as well as materials that require high-temperature processing.epoxy resin adhesive: steam, heat conduction oil, hot water, cooling water and etc. It can be operated both continuously and intermittently. It can be applied for many fields.
âLess environmental pollution:No carrying air is used and less dust materials are entrained. Evaporation of material solvent is very small, which is easy to handle. For materials which may cause pollution or working conditions that require solvent recovery, closed loop can be used.
âLow operating cost:Reasonable structure, less abrasion amount and low maintenance cost.
âStable operation:Due to compression-expansion and stirring effect of special wedge-CPU thermal pad, material particles are fully in contact with heat transfer surface. In axial interval, gradient of materials’ temperature, humidity,Thermal Pad 0.5mm, thereby ensuring the process stability.
ããWedge-Computer Thermal Pads.Thermal Pad 0.5mm. It can be both steam and liquid such as hot water, heat conduction oil and etc. For indirect conduction heating condition, heat is all used to heat materials. Heat loss is only caused by heat dissipation to the environment through insulation la
Heatsink Thermal Pad.Thermal Pads for CPU.Heatsink Thermal Pad:
Model | KGX3 | KGX9 | KGX13 | KGX18 | KGX29 | KGX41 | KGX52 | KGX68 | KGX81 | KGX95 | KGX110 |
Heat transfer area(m2) | 3 | 9 | 13 | 18 | 29 | 41 | 52 | 68 | 81 | 95 | 110 |
Effective volume(m3) | 0.06 | 0.32 | 0.59 | 1.09 | 1.85 | 2.8 | 3.96 | 5.21 | 6.43 | 8.07 | 9.46 |
Heatsink Thermal Pad(rmp) | 15-30 | 10-25 | 10-25 | 10-20 | 10-20 | 10-20 | 10-20 | 10-20 | 5-15 | 5-15 | 5-10 |
Power(kw) | 2.2 | 4 | 5.5 | 7.5 | 11 | 15 | 30 | 45 | 55 | 75 | 95 |
Width of body A(mm) | 306 | 584 | 762 | 940 | 1118 | 1296 | 1476 | 1652 | 1828 | 2032 | 2210 |
Total width B(mm) | 736 | 841 | 1066 | 1320 | 1474 | 1676 | 1854 | 2134 | 1186 | 2438 | 2668 |
Width of body C(mm) | 1956 | 2820 | 3048 | 3328 | 4114 | 4724 | 5258 | 5842 | 6020 | 6124 | 6122 |
Length of body D(mm) | 2972 | 4876 | 5486 | 5918 | 6808 | 7570 | 8306 | 9296 | 9678 | 9704 | 9880 |
Distance of feedind and discharging E(mm) | 1752 | 2540 | 2768 | 3048 | 3810 | 4420 | 4954 | 5384 | 5562 | 5664 | 5664 |
Center height F(mm) | 380 | 380 | 534 | 610 | 762 | 915 | 1066 | 1220 | 1220 | 1220 | 1220 |
Total height H(mm) | 762 | 838 | 1092 | 1270 | 1524 | 1778 | 2032 | 2362 | 2464 | 2566 | 2668 |
Air inlet (inch) | 3/4 | 3/4 | 1 | 1 | 1 | 1 | 11/2 | 11/2 | 11/2 | 11/2 | 2 |
Water oulet (inch) | 3/4 | 3/4 | 1 | 1 | 1 | 1 | 11/2 | 11/2 | 11/2 | 11/2 | 2 |
If you are interested in our company or products,Thermall Pad for UPS.Thermal Pad 0.5mm. Meanwhile, We will get in touch with you as soon as possible for further discussion.
ZONELION® TAEDA®. Address of headquartersï¼High-tech zone, zhengzhou city, ChinaAluminum Boron Cut Cast Bar