







ãApplicable materialãï¼good performance red glue, yeast,china red glue, paper pulp, residue slag and other wastes.
ãOptional fuelãï¼Steam, conduction oil, and hot water. Higher the potential heat and temperature are, the higher thermal efficiency will be.
ãMaterial moistureãï¼80%-25%.
ãApplication rangeãï¼stencil printing red glue, chemical industry, petroleum,SMT Red glue.
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Unicorn Inflatable Swimming RingRed glue.High Quality Thermal Pad, rotating shaft, shell (Thermal Pad Free),Heatsink Thermal Pad.CPU thermal pad,Thermal Pads for CPU. The main body is installed horizontally (or inclined). Material enters dryer from the front end and shell form a slight inclination angle with horizontal plane and rotating shaft. The product moves to the discharge end relying on its own weight along with rotation of the rotating shaft. At the discharge end, product flows out of the equipment through overflow port and enters the next process.High Quality Thermal Pad,Computer Thermal Pads for Sale/CPU thermal pad.
Thermal Pad Best Price, reaction, cooling, crystallization, evaporation, heating and disinfection, and low-temperature calcination.Thermal Pads for CPU. One machine can fulfill multiple purposes.
ããAccording to different heat exchange media,High Quality Thermal Pad, steam (saturated steam or superheated steam) type and liquid (hot water, heat conduction oil,red SMD glue, refrigerant, soft cold water or chilled water) type.SMT Red glue.good performance red glue(steam, heat conduction oil or water) is always separated from product.red glue epoxy resin adhesive, it is divided into single shaft,chip-bonding red glue. According to different operating pressure, it is divided into vacuum, normal pressure and positive pressure type.
epoxy resin adhesive.cheap red glue. Heat exchange surface has self-cleaning function.Red glue,good performance red glue’ surface so that rotating shaft always maintains a clean heat transfer surface during operation.
Multiple operation mode:ã
red glue epoxy resin adhesive, chemical, petrochemical, dye,red SMD glue. Characteristics of heat transfer, cooling, and stirring of the equipment enable it to complete following unit operations: cooling,chip-bonding red glue(solvent recovery), heating (melting), reaction and sterilization.epoxy resin adhesive, which increases heat transfer area in unit effective volume and shortens processing time. Wedge-Red glue-cleaning function.china red glue. Material moves in a "piston flow" along axial direction. In axial interval, gradient of materials’ temperature, humidity,stencil printing red glue.
ããSpecifically, it can operate: calcium sulfate dehydrate (Ca2SO4•2H2O) is burned into calcium sulfate hemihydrate (Ca2SO4•1/22H2O); sodium bicarbonate (NaHCO3) is converted into soda ash (Na2HCO3) after calcination.good performance red glue, cooling brine and etc. For example, blade-type alkali cooling machine used in soda ash industry replaces old air-cooled alkali cooling machine, which saves energy consumption, reduces exhaust gas treatment equipment and decreases operating costs.china red glue,red glue epoxy resin adhesive, which makes energy consumption and environmental control in an ideal easy handling state. It has been widely used in fine chemical, petrochemical and dye industries.
Applicable material:
âPetrochemical industry: polyolefin powder, polycarbonate resin, high and low density polyethylene, linear low density polyethylene, polyacetal particles, nylon 6, nylon 66, nylon 12, cellulose acetate, polyphenylene sulfide, propylene Base resin, engineering plastic, polyvinyl chloride, polyvinyl alcohol, polystyrene, polypropylene, polyester, polyoxymethylene, styrene-acrylonitrile copolymer, and ethylene-propylene copolymer.
âEnvironmental protection industry:stencil printing red glue,red SMD glue, boiler soot, pharmaceutical factory waste residue, sugar factory waste residue, MSG factory waste residue and coal ash.
âFeed industry: soy sauce residue, bone-based feed, distiller's grains, food scraps, apple pomace, orange peel, soybean meal, chicken bone feed, fish meal, feed additives and biological residue mud.
âFood industry: starch, cocoa beans, corn kernels, salt, modified starch and medicines.
âChemical industry: soda ash, nitrogen, phosphorus and potassium compound fertilizer, kaolin, bentonite, white carbon black, carbon black, phosphogypsum, sodium fluoride oxide, calcium nitrate, magnesium carbonate, sodium cyanide, aluminum hydroxide, barium sulfate, calcium sulfate, Calcium carbonate, dyes, molecular sieves, and saponin.
âLow energy consumption:Due to indirect heating, there is no large amount of air taking away heat. Outer wall of dryer is equipped with insulation la
âepoxy resin adhesive:Unit effective volume has a huge heat transfer surface, which shortens the processing time and reduces the equipment size. Meanwhile, greatly building area and space are greatly reduced.
âWide range of processing materials:SMT Red glue, it can process heat-sensitive materials as well as materials that require high-temperature processing.Red glue: steam, heat conduction oil, hot water, cooling water and etc. It can be operated both continuously and intermittently. It can be applied for many fields.
âLess environmental pollution:No carrying air is used and less dust materials are entrained. Evaporation of material solvent is very small, which is easy to handle. For materials which may cause pollution or working conditions that require solvent recovery, closed loop can be used.
âLow operating cost:Reasonable structure, less abrasion amount and low maintenance cost.
âStable operation:Due to compression-expansion and stirring effect of special wedge-cheap red glue, material particles are fully in contact with heat transfer surface. In axial interval, gradient of materials’ temperature, humidity,red glue epoxy resin adhesive, thereby ensuring the process stability.
ããWedge-epoxy resin adhesive.CPU thermal pad. It can be both steam and liquid such as hot water, heat conduction oil and etc. For indirect conduction heating condition, heat is all used to heat materials. Heat loss is only caused by heat dissipation to the environment through insulation la
Computer Thermal Pads.Thermal Pad 0.5mm.Thermall Pad for UPS:
Model | KGX3 | KGX9 | KGX13 | KGX18 | KGX29 | KGX41 | KGX52 | KGX68 | KGX81 | KGX95 | KGX110 |
Heat transfer area(m2) | 3 | 9 | 13 | 18 | 29 | 41 | 52 | 68 | 81 | 95 | 110 |
Effective volume(m3) | 0.06 | 0.32 | 0.59 | 1.09 | 1.85 | 2.8 | 3.96 | 5.21 | 6.43 | 8.07 | 9.46 |
Heatsink Thermal Pad(rmp) | 15-30 | 10-25 | 10-25 | 10-20 | 10-20 | 10-20 | 10-20 | 10-20 | 5-15 | 5-15 | 5-10 |
Power(kw) | 2.2 | 4 | 5.5 | 7.5 | 11 | 15 | 30 | 45 | 55 | 75 | 95 |
Width of body A(mm) | 306 | 584 | 762 | 940 | 1118 | 1296 | 1476 | 1652 | 1828 | 2032 | 2210 |
Total width B(mm) | 736 | 841 | 1066 | 1320 | 1474 | 1676 | 1854 | 2134 | 1186 | 2438 | 2668 |
Width of body C(mm) | 1956 | 2820 | 3048 | 3328 | 4114 | 4724 | 5258 | 5842 | 6020 | 6124 | 6122 |
Length of body D(mm) | 2972 | 4876 | 5486 | 5918 | 6808 | 7570 | 8306 | 9296 | 9678 | 9704 | 9880 |
Distance of feedind and discharging E(mm) | 1752 | 2540 | 2768 | 3048 | 3810 | 4420 | 4954 | 5384 | 5562 | 5664 | 5664 |
Center height F(mm) | 380 | 380 | 534 | 610 | 762 | 915 | 1066 | 1220 | 1220 | 1220 | 1220 |
Total height H(mm) | 762 | 838 | 1092 | 1270 | 1524 | 1778 | 2032 | 2362 | 2464 | 2566 | 2668 |
Air inlet (inch) | 3/4 | 3/4 | 1 | 1 | 1 | 1 | 11/2 | 11/2 | 11/2 | 11/2 | 2 |
Water oulet (inch) | 3/4 | 3/4 | 1 | 1 | 1 | 1 | 11/2 | 11/2 | 11/2 | 11/2 | 2 |
If you are interested in our company or products,Thermal Pad 0.5mm.Heatsink Thermal Pad. Meanwhile, We will get in touch with you as soon as possible for further discussion.
ZONELION® TAEDA®. Address of headquartersï¼High-tech zone, zhengzhou city, ChinaInsulation Glass Silicone Sealant